A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages

Fast Monotonic Via Assignment Excluding Mold Gates for 2-Layer Ball Grid Array Packages

Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer Ball Grid Array packages to support designers. Our method obtains a via assignment which distributes wires evenly on top layer and has high completion rati...

Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages

A New Approach to the Ball Grid Array Package Routing

Due to the large number of I/O’s in a BallGrid-Array (BGA) package, routing becomes more and more an important work. A ring-based router for the BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of layer assignment, topological routing, and physical routing. Using this ...

An Even Wiring Approach to the Ball Grid Array Package Routing

An even-wiring router for the BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of layer assignment, topological routing, and physical routing. Using this router, we can generate an even distribution of planar and any-angle wires to improve manufacturing yield. We have ...

Planar Interchangeable 2-terminal Routing

abstract Many practical routing problems such as BGA, PGA and test xture routing involve routing two-terminal nets on a plane with exchangeable pins. In this paper, we unify these diierent problems as instances of the Planar Interchangeable 2-Terminal Routing (PI2TR) problem. We formulate the problem as ows in a routing network. Secondly, we show that PI2TR is NP-complete by reduction from sati...